No. of layers | Flex pcb | 1 8 Layers |
---|---|---|
Rigid | Single, Double layer | |
Surface insulation | Surface insulation | |
Laminate thickness (Excluding stiffener thickness) |
Flex pcb | 5 mils to 13 mils (0.125mm to 0.762mm) |
Rigid | 0.4 to 3.2 mm for rigid circuits | |
Max working pane | 20 x 18 (500mm x 450mm) | |
Min finished hole | 0.012 (0.30 mm) | |
Min.track width / space | 4 mils / 4 mils (0.10mm / 0.10mm) | |
Surface Finish | Electrolytic tin Plating | |
Immersion tin Plating | ||
Immersion silver Plating | ||
Hot Air Solder Leveling- lead free solder (HAL) | ||
Electroless Gold Plating (ENIG) | ||
Direct gold over copper, OSP etc. |