| No. of layers | Flex pcb | 1 – 8 Layers |
|---|---|---|
| Rigid | Single, Double layer | |
| Surface insulation | Surface insulation | |
| Laminate thickness (Excluding stiffener thickness) |
Flex pcb | 5 mils to 13 mils (0.125mm to 0.762mm) |
| Rigid | 0.4 to 3.2 mm for rigid circuits | |
| Max working pane | 20” x 18” (500mm x 450mm) | |
| Min finished hole | 0.012” (0.30 mm) | |
| Min.track width / space | 4 mils / 4 mils (0.10mm / 0.10mm) | |
| Surface Finish | Electrolytic tin Plating | |
| Immersion tin Plating | ||
| Immersion silver Plating | ||
| Hot Air Solder Leveling- lead free solder (HAL) | ||
| Electroless Gold Plating (ENIG) | ||
| Direct gold over copper, OSP etc. |